We use cookies to make your experience better.
To comply with the new e-Privacy directive, you agree to the privacy policy and our use of cookies.
Team Group XTREEM memory module 48 GB 2 x 24 GB DDR5 8000 MHz ECC
SKU
FFXD548G8000HC38EDC01
- Honorable T-FORCE Logo exceeds overclocking limits
- Meticulously layered high-quality aluminum sandblasted fin for exceptional heat dissipation
- Sturdy 2mm heat spreader for perfect heat dissipation improvement
- High-quality IC with the patented technique
- Power management chip for stable and effective power usage
- On-Die ECC for a more stable system
| Internal memory type | DDR5 |
|---|---|
| Memory clock speed | 8000 MHz |
| ECC | Yes |
| Memory form factor | 288-pin DIMM |
| SKU | FFXD548G8000HC38EDC01 |
| EAN | 4711430800851 |
| Manufacturer | Team Group |
| Product Family | XTREEM |
| Product Manuals (HTML) |
View Manual |
Honorable T-FORCE Logo exceeds overclocking limits
With T-FORCE LAB’s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products.
Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation
Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities. The surface is etched with T-FORCE logo to certify its excellence.
Sturdy 2mm heat sink for perfect heat dissipation improvement
T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity. The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall.
High-quality IC with patented technique
Uses our proprietary IC grading testing validation technique—GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully.
Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.
On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.
With T-FORCE LAB’s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory. The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products.
Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation
Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities. The surface is etched with T-FORCE logo to certify its excellence.
Sturdy 2mm heat sink for perfect heat dissipation improvement
T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity. The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall.
High-quality IC with patented technique
Uses our proprietary IC grading testing validation technique—GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully.
Power management chip for stable and effective power usage
Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness.
On-Die ECC for a more stable system
Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance.
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 2 x 24 GB |
| Internal memory | 48 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 38 |
| Memory voltage | 1.4 V |
| ECC | Yes |
| Memory clock speed | 8000 MHz |
| Internal memory type | DDR5 |
| Power | |
| Memory voltage | 1.4 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
|---|---|
| Cooling type | Heatsink |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 2 x 24 GB |
| Internal memory | 48 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 38 |
| Memory voltage | 1.4 V |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 8000 MHz |
| Internal memory type | DDR5 |
| Weight & dimensions | |
| Width | 8.2 mm |
| Depth | 134.5 mm |
| Height | 48.8 mm |
| Package type | Box |
| Packaging data | |
| Package type | Box |