Akasa AK-460 Thermal Compound heat sink compound 3.3 W/m·K 3.5 g

SKU

AK-460

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AK-460 Thermal Compound

More Information
SKU	AK-460
EAN	4710614525023
Manufacturer	Akasa
Availability	Out of Stock

Description

Pro-Grade Silicone Technology Evolution leads to Outstanding Thermal Performance

Pro-grade Silicone technology evolution thermal compound delivers a stable and reliable thermal performance. Minimised resistance and maximised efficiency truly enables you to get more from your cooler. RoHS compliant.

Features
- Outstanding performance of heat transfer between CPU and heatsink.
- Low thermal resistance for heat transfer, 0.16cm²C/W @60 um BLT.
- Maximum thermal conductivity, 3.3W/mK.
- Electrically non-conductive.
- Low bleed under high pressure.
- Multi-language instructions included.

Specifications

Features
Viscosity note	102K cPs
Thermal conductivity	3.3 W/m·K
Operating temperature (T-T)	-45 - 200 °C
Technical details
Operating range	0.16cm²C/W @60um BLT
Viscosity note	102K cPs
Thermal conductivity	3.3 W/m·K
Operating temperature (T-T)	-45 - 200 °C

Weight & dimensions
Weight	3.5 g
Operational conditions
Operating temperature (T-T)	-45 - 200 °C

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Akasa AK-460 Thermal Compound heat sink compound 3.3 W/m·K 3.5 g

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